NASA scientists have created a computer chip that can withstand the high temperature of the surface of Venus, according to the official website of the agency. This planet is known for having the hottest surface in the solar system (over 800 degrees Fahrenheit).
It is planned that this chip will be installed on a future Venus rover, which NASA will send to the planet by 2023. The event promises to be truly grandiose, because humanity has not sent space probes to Venus since 1982.
The new computer chip, which was invented at NASA's Glenn Research Center, is capable of operating in the extreme conditions of Venus for 521 hours, or about 22 days.
Most chips are made of silicon. At high temperatures, these chips begin to behave like normal conductors rather than semiconductors. The newest chip, created by NASA, is made of silicon carbide – it maintains stable semiconducting properties even at high temperatures. In addition, the research team ensures that the wires connecting all parts of the chip will not burn, as they are made of extremely resistant materials such as tantalum silicide.
Scientists of the mission are confident that a more detailed study of the geological processes and greenhouse gases of the atmosphere of the second planet from the Sun can help in understanding the processes that are taking place today on planet Earth.
Sources: science
